Invention Application
- Patent Title: Packaging Structure and Power Amplifier
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Application No.: US17570575Application Date: 2022-01-07
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Publication No.: US20220131510A1Publication Date: 2022-04-28
- Inventor: Xiaomin Zhang , Mingli Huang , Ran Jiang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201910615283.3 20190709
- Main IPC: H03F3/24
- IPC: H03F3/24 ; H01L23/373 ; H01L23/498 ; H01L23/00
Abstract:
A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.
Information query
IPC分类:
