Invention Application
- Patent Title: FLUORIDE-BASED RESIN PREPREG AND CIRCUIT SUBSTRATE USING THE SAME
-
Application No.: US17381201Application Date: 2021-07-21
-
Publication No.: US20220132661A1Publication Date: 2022-04-28
- Inventor: TE-CHAO LIAO , HAO-SHENG CHEN , CHIH-KAI CHANG , HUNG-YI CHANG
- Applicant: NAN YA PLASTICS CORPORATION
- Applicant Address: TW TAIPEI
- Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee Address: TW TAIPEI
- Priority: TW109137039 20201026
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B27/20 ; B32B27/12 ; B32B27/32

Abstract:
A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.
Public/Granted literature
- US11903127B2 Fluoride-based resin prepreg and circuit substrate using the same Public/Granted day:2024-02-13
Information query