Invention Application
- Patent Title: ENCLOSURES HAVING AN ANTI-FINGERPRINT SURFACE
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Application No.: US17573694Application Date: 2022-01-12
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Publication No.: US20220132690A1Publication Date: 2022-04-28
- Inventor: Jaymin Amin , Jaques Gollier , Shandon Dee Hart , Karl William Koch, III , Wageesha Senaratne
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Main IPC: H05K5/02
- IPC: H05K5/02 ; C03C3/091 ; C03C15/00 ; B24C3/32 ; C09D5/00 ; G06F1/16 ; C03C3/083 ; B24C1/04 ; C03C21/00 ; B24C1/00 ; C03C19/00 ; H05K5/00

Abstract:
Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.
Public/Granted literature
- US12052835B2 Enclosures having an anti-fingerprint surface Public/Granted day:2024-07-30
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