Invention Application
- Patent Title: Method and Apparatus for Inspecting Pattern Collapse Defects
-
Application No.: US17089158Application Date: 2020-11-04
-
Publication No.: US20220138921A1Publication Date: 2022-05-05
- Inventor: Shin-Yee LU , Ivan MALEEV
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T5/40 ; G06T5/20 ; G06N3/08

Abstract:
A method for detecting defects on a sample based on a defect inspection apparatus is provided. In the method, an image data set that includes defect data and non-defect data is organized. A convolutional neural network (CNN) model is defined. The CNN model is trained based on the image data set. The defects on the sample are detected based on inspection data of the defect inspection apparatus and the CNN model. The sample includes uniformly repeating structures, and the inspection data of the defect inspection apparatus is generated by filtering out signals of the uniformly repeating structures of the sample.
Public/Granted literature
- US11676266B2 Method and apparatus for inspecting pattern collapse defects Public/Granted day:2023-06-13
Information query