Invention Application
- Patent Title: SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
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Application No.: US17086189Application Date: 2020-10-30
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Publication No.: US20220139726A1Publication Date: 2022-05-05
- Inventor: Chenghan SHE
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/67 ; B29C43/18 ; B29C43/34
Abstract:
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
Public/Granted literature
- US11887865B2 System and method for manufacturing a semiconductor package structure Public/Granted day:2024-01-30
Information query
IPC分类:
