Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
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Application No.: US17109153Application Date: 2020-12-02
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Publication No.: US20220140139A1Publication Date: 2022-05-05
- Inventor: Sheng-Yao Huang , Yu-Ruei Chen , Zen-Jay Tsai , Yu-Hsiang Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN202011177946.7 20201029
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L21/265

Abstract:
A semiconductor structure includes a substrate, a buried oxide layer formed in the substrate and near a surface of the substrate, a gate dielectric layer formed on the substrate and covering the buried oxide layer, a gate structure formed on the gate dielectric layer and overlapping the buried oxide layer, and a source region and a drain region formed in the substrate and at two sides of the gate structure.
Public/Granted literature
- US11626515B2 High voltage semiconductor device including buried oxide layer and method for forming the same Public/Granted day:2023-04-11
Information query
IPC分类: