A method of mounting a connection element structure on a target is introduced and includes providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target. Therefore, the method can mount the connection element structure on the target, enhancing the efficiency of subsequent processes.