Invention Application
- Patent Title: ENERGY-SENSITIVE COMPOSITION, CURED PRODUCT, AND FORMING METHOD OF CURED PRODUCT
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Application No.: US17452353Application Date: 2021-10-26
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Publication No.: US20220145011A1Publication Date: 2022-05-12
- Inventor: Kunihiro NODA , Hiroki CHISAKA , Kazuya SOMEYA , Dai SHIOTA
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2020-185799 20201106
- Main IPC: C08G77/52
- IPC: C08G77/52 ; C08K5/1545 ; C08K5/5399 ; C08G77/16 ; C08K5/3445 ; B05D3/02 ; B05D3/04

Abstract:
An energy-sensitive composition that yields a cured product with excellent thermal resistance and crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes an ionic compound and a nonionic compound. An anion moiety in the ionic compound preferably includes at least one of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton.
Public/Granted literature
- US11905433B2 Energy-sensitive composition, cured product, and forming method of cured product Public/Granted day:2024-02-20
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