Invention Application
- Patent Title: RESIN SHEET
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Application No.: US17441688Application Date: 2020-03-17
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Publication No.: US20220145151A1Publication Date: 2022-05-12
- Inventor: Yasutaka WATANABE , Yasunori KARASAWA
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2019-055181 20190322
- International Application: PCT/JP2020/011589 WO 20200317
- Main IPC: C09J179/08
- IPC: C09J179/08 ; C09J7/35 ; C09J7/10 ; C09J11/06 ; H01L23/29

Abstract:
A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.
Information query
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