公开(公告)号：US20230097896A1

公开(公告)日：2023-03-30

申请号：US17792349

申请日：2021-01-15

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yasunori KARASAWA

IPC: C08G73/12 ,  C08J5/18 ,  C08G8/10 ,  C08K5/3492 ,  C08K3/22 ,  C08K3/38 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

Abstract: A resin sheet is formed of a resin composition containing a thermosetting component (A), in which the thermosetting component (A) contains a maleimide resin and a thermal diffusion rate of the resin sheet after being thermally cured is 1.25×10−6 m2/s or more, a peel strength of the resin sheet after being thermally cured is 2.0 N/10 mm or more.

公开(公告)号：US20200027754A1

公开(公告)日：2020-01-23

申请号：US16488058

申请日：2018-02-27

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yusuke NEZU ,  Takashi SUGINO

IPC: H01L21/56 ,  C09J7/38 ,  C09J11/04 ,  B32B7/12 ,  B32B37/12

Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.

公开(公告)号：US20230090587A1

公开(公告)日：2023-03-23

申请号：US17792615

申请日：2021-01-15

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yasunori KARASAWA ,  Kazue UEMURA

IPC: C08L79/08 ,  C09D179/08

Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10−6 m2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet, 0.25≤Ld/Lt≤1  (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.

公开(公告)号：US20230064310A1

公开(公告)日：2023-03-02

申请号：US17792575

申请日：2021-01-15

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yasunori KARASAWA ,  Kazue UEMURA ,  Yasuhiko KAKIUCHI

IPC: C08L79/08

Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0 × 10-6 m2/s or more. The resin sheet has a thickness in a range from 5 µm to 120 µm .

公开(公告)号：US20220145151A1

公开(公告)日：2022-05-12

申请号：US17441688

申请日：2020-03-17

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yasunori KARASAWA

IPC: C09J179/08 ,  C09J7/35 ,  C09J7/10 ,  C09J11/06 ,  H01L23/29

Abstract: A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.