An electrostatic clamp for supporting a substrate includes a substrate region, an electrode region at an edge of the substrate region, a support layer, an electrically conductive layer, a contact layer, and an electrode. The support layer has a body having first and second surfaces that are substantially parallel to each other and disposed on opposite sides of the body. A through-hole is disposed in the electrode region and provides access between the first and second surfaces. The electrically conductive layer is disposed on the second surface of the support layer. The contact layer disposed on the electrically conductive layer. The contact layer is uninterrupted in the electrode region and comprises burls in the substrate region. The burls contact the substrate when the electrostatic clamp is supporting the substrate. The electrode is disposed in the through-hole and is electrically coupled to the electrically conductive layer.