公开(公告)号：US20220146948A1

公开(公告)日：2022-05-12

申请号：US17438021

申请日：2020-03-06

Applicant: ASML Holding N.V.

Inventor： Hari KRISHNAN ,  Joseph Harry LYONS ,  Eric Justin MONKMAN ,  Victor Antonio PEREZ-FALCON

IPC: G03F7/20 ,  H01L21/683

Abstract: An electrostatic clamp for supporting a substrate includes a substrate region, an electrode region at an edge of the substrate region, a support layer, an electrically conductive layer, a contact layer, and an electrode. The support layer has a body having first and second surfaces that are substantially parallel to each other and disposed on opposite sides of the body. A through-hole is disposed in the electrode region and provides access between the first and second surfaces. The electrically conductive layer is disposed on the second surface of the support layer. The contact layer disposed on the electrically conductive layer. The contact layer is uninterrupted in the electrode region and comprises burls in the substrate region. The burls contact the substrate when the electrostatic clamp is supporting the substrate. The electrode is disposed in the through-hole and is electrically coupled to the electrically conductive layer.

公开(公告)号：US20220236649A1

公开(公告)日：2022-07-28

申请号：US17613972

申请日：2020-05-11

Applicant: ASML HOLDING N.V.

Inventor： Matthew LIPSON ,  Eric Justin MONKMAN ,  Victor Antonio PEREZ-FALCON

IPC: G03F7/20 ,  H01L21/683

Abstract: An electrostatic clamp and a method for fabricating the same. The electrostatic clamp includes a first stack and a second stack, wherein the first stack is joined with the second stack. Each of the first and second stacks includes a clamp body, one or more electrodes disposed on the clamp body, a dielectric plate disposed on the electrodes, and a plurality of channels inside the clamp body.

公开(公告)号：US20220057723A1

公开(公告)日：2022-02-24

申请号：US17415715

申请日：2019-12-12

Applicant: ASML Holding N.V.

Inventor： Eric Justin MONKMAN ,  Michael Andrew CHIEDA ,  Stephen ROUX ,  Victor Antonio PEREZ-FALCON

IPC: G03F7/20

Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.

公开(公告)号：US20220113639A1

公开(公告)日：2022-04-14

申请号：US17430275

申请日：2020-01-27

Applicant: ASML Holding N.V.

Inventor： Kushal Sandeep DOSHI ,  Eric Justin MONKMAN ,  John Robert BURROUGHS ,  Sudhanshu NAHATA ,  Stefan Luka COLTON

IPC: G03F7/20

Abstract: An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus under an applied force. The apparatus can further include a bonding layer disposed between the first and second substrates. The bonding layer is configured to bond the intermediate layer to the first and second substrates. The apparatus can further include a fastener coupled to the first and second substrates. The fastener is configured to secure the intermediate layer to the first and second substrates. The intermediate layer can include a coating applied to the first substrate or the second substrate. The apparatus can further include a second intermediate layer disposed between the first substrate and the fastener or the second substrate and the fastener.