Invention Application
- Patent Title: LIGHT-EMITTING MODULE
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Application No.: US17580193Application Date: 2022-01-20
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Publication No.: US20220149233A1Publication Date: 2022-05-12
- Inventor: Eiko MINATO , Koji TAGUCHI , Yumiko KAMESHIMA , Masaaki KATSUMATA
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2019-085494 20190426,JP2019-215168 20191128
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L33/24 ; H01L33/62

Abstract:
A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.
Public/Granted literature
- US11611014B2 Light-emitting module Public/Granted day:2023-03-21
Information query
IPC分类: