公开(公告)号：US20200243711A1

公开(公告)日：2020-07-30

申请号：US16774614

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki SATO ,  Masaaki KATSUMATA ,  Shinichi DAIKOKU ,  Yoshikazu MATSUDA ,  Ryuma MARUME ,  Eiko MINATO

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

公开(公告)号：US20240213427A1

公开(公告)日：2024-06-27

申请号：US18389775

申请日：2023-12-20

Applicant: NICHIA CORPORATION

Inventor： Atsushi HOSOKAWA ,  Masaaki KATSUMATA ,  Eiko MINATO

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L24/16 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.

公开(公告)号：US20220149233A1

公开(公告)日：2022-05-12

申请号：US17580193

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Koji TAGUCHI ,  Yumiko KAMESHIMA ,  Masaaki KATSUMATA

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24 ,  H01L33/62

Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

公开(公告)号：US20250096054A1

公开(公告)日：2025-03-20

申请号：US18830590

申请日：2024-09-11

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Atsushi HOSOKAWA ,  Akiko NAGAE ,  Takashi KAWAMATA

IPC: H01L23/15 ,  C04B41/00 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.

公开(公告)号：US20220302341A1

公开(公告)日：2022-09-22

申请号：US17830148

申请日：2022-06-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki SATO ,  Masaaki KATSUMATA ,  Shinichi DAIKOKU ,  Yoshikazu MATSUDA ,  Ryuma MARUME ,  Eiko MINATO

IPC: H01L33/00 ,  H01L25/075

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.

公开(公告)号：US20240355987A1

公开(公告)日：2024-10-24

申请号：US18637994

申请日：2024-04-17

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Atsushi HOSOKAWA

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

Abstract: A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.

公开(公告)号：US20240092701A1

公开(公告)日：2024-03-21

申请号：US18468650

申请日：2023-09-15

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Akiko NAGAE

IPC: C04B41/51 ,  C04B37/00 ,  C04B41/00 ,  C04B41/45 ,  C04B41/53 ,  H01L33/62

CPC classification number: C04B41/5183 ,  C04B37/006 ,  C04B41/0072 ,  C04B41/4521 ,  C04B41/5307 ,  H01L33/62 ,  C04B2237/12 ,  H01L2933/0066

Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.

公开(公告)号：US20230420269A1

公开(公告)日：2023-12-28

申请号：US18342424

申请日：2023-06-27

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Masaaki KATSUMATA ,  Atsushi HOSOKAWA

IPC: H01L21/48 ,  H01L33/62 ,  H01L23/498

CPC classification number: H01L21/4867 ,  H01L33/62 ,  H01L23/49827 ,  H01L2933/0066 ,  H01L25/0753

Abstract: A method of manufacturing a wiring substrate includes providing a conductive paste including metal nanoparticles, metal particles, and a resin, disposing the conductive paste on at least a first surface of an insulating base body, and forming a wiring layer by heating and pressurizing the conductive paste by using a roll press or a hard SUS plate. In the providing the conductive paste, the ratio of a mass of the metal nanoparticles to the total mass of the metal nanoparticles and the metal particles is in a range of 5 mass % to 95 mass %, and the conductive paste is heated and pressurized such that part of the wiring layer in a thickness direction is embedded in at least the first surface of the insulating base body.

公开(公告)号：US20220232700A1

公开(公告)日：2022-07-21

申请号：US17715033

申请日：2022-04-07

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Yumiko KAMESHIMA ,  Koji TAGUCHI ,  Masaaki KATSUMATA

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.

公开(公告)号：US20220037567A1

公开(公告)日：2022-02-03

申请号：US17280047

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Yumiko KAMESHIMA ,  Eiko MINATO ,  Koji TAGUCHI ,  Masaaki KATSUMATA

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

Abstract: A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.