Disclosed is a method for controlling the temperature of a heater which has a single plate-shaped member formed of a semiconductor substrate, and three or more electrodes formed on a side surface of the single plate-shaped member while being spaced apart from each other in a circumference direction, the method comprising a step for heating the plate-shaped member by supplying a power between the electrodes and sequentially changing the pair of electrodes to which the power is supplied, wherein a period of time in which the power is supplied between the electrodes in the heating step is individually determined for each set of electrodes.