Invention Application
- Patent Title: THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE
-
Application No.: US17595957Application Date: 2020-08-03
-
Publication No.: US20220154009A1Publication Date: 2022-05-19
- Inventor: Kazuo OTANI , Shinji NUMAO , Nobuyuki TAKAHASHI , Ryota NIIBAYASHI
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-144424 20190806,JP2020-092437 20200527
- International Application: PCT/JP2020/029649 WO 20200803
- Main IPC: C09D5/00
- IPC: C09D5/00 ; C09D123/26 ; C09D171/12
Abstract:
A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.
Information query
IPC分类:
