A coil module includes a substrate, a conductor layer, at least one element, and a sealing resin. The substrate includes a semiconductor material. The conductor layer is formed on the substrate and includes a wiring section and a coil section of a helical shape. The at least one element is mounted on the wiring section. The sealing resin covers the obverse surface of the substrate, the conductor layer, and the at least one element. The at least one element includes, for example, a magnetic detection element.