An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.