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公开(公告)号：US20210267044A1
公开(公告)日：2021-08-26
申请号：US17249084
申请日：2021-02-19
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
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公开(公告)号：US11523496B2
公开(公告)日：2022-12-06
申请号：US17249084
申请日：2021-02-19
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
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公开(公告)号：US11264737B2
公开(公告)日：2022-03-01
申请号：US16814684
申请日：2020-03-10
摘要： A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.
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公开(公告)号：US11051406B2
公开(公告)日：2021-06-29
申请号：US16446434
申请日：2019-06-19
摘要： Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.
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公开(公告)号：US20200295474A1
公开(公告)日：2020-09-17
申请号：US16814684
申请日：2020-03-10
摘要： A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.
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公开(公告)号：US20190394878A1
公开(公告)日：2019-12-26
申请号：US16446434
申请日：2019-06-19
摘要： Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.
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公开(公告)号：US20220190464A1
公开(公告)日：2022-06-16
申请号：US17653628
申请日：2022-03-04
发明人： Marco Gavagnin , Markus Leitgeb , Ahmad Bader Alothman Alterkawi , Ferdinand Lutschounig , Heinz Moitzi , Thomas Krivec , Gernot Grober , Erich Schlaffer , Mike Morianz , Rainer Frauwallner , Hubert Haidinger , Gernot Schulz , Gernot Gmunder
摘要： A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.
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公开(公告)号：US20220158366A1
公开(公告)日：2022-05-19
申请号：US17649969
申请日：2022-02-04
摘要： An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.
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9.发明申请公开(公告)号：US20190110366A1
公开(公告)日：2019-04-11
申请号：US16153565
申请日：2018-10-05
发明人： Marco Gavagnin , Markus Leitgeb , Jonathan Silvano de Sousa , Ferdinand Lutschounig , Heinz Moitzi , Thomas Krivec , Gernot Grober , Erich Schlaffer , Mike Morianz , Rainer Frauwallner , Hubert Haidinger , Gernot Schulz , Gernot Gmunder
摘要： A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.
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