- 专利标题: COPPER ALLOY PLATE AND METHOD FOR PRODUCUING SAME
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申请号: US17602391申请日: 2020-01-30
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公开(公告)号: US20220162734A1公开(公告)日: 2022-05-26
- 发明人: Kazuki Yoshida , Takanobu Sugimoto , Tomotsugu Aoyama , Hiroto Narieda
- 申请人: DOWA METALTECH CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: DOWA METALTECH CO., LTD.
- 当前专利权人: DOWA METALTECH CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-077509 20190416
- 国际申请: PCT/JP2020/003320 WO 20200130
- 主分类号: C22F1/08
- IPC分类号: C22F1/08 ; C22C9/04
摘要:
There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
公开/授权文献
- US12049690B2 Copper alloy plate and method for producing same 公开/授权日:2024-07-30
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