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公开(公告)号：US20220162734A1
公开(公告)日：2022-05-26
申请号：US17602391
申请日：2020-01-30
摘要： There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
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公开(公告)号：US20190264313A1
公开(公告)日：2019-08-29
申请号：US16345298
申请日：2017-10-24
摘要： There are provided an inexpensive sheet material of a copper alloy having an excellent bending workability and an excellent stress corrosion cracking resistance while maintaining a high strength, and a method for producing the same. The sheet material of the copper alloy is produced by a method comprising the steps of: melting and casting raw materials of a copper alloy which has a chemical composition comprising 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.01 to 2.0% by weight of silicon, 0.01 to 5.0% by weight of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy in a temperature range of from 900° C. to 400° C.; cooling the hot-rolled copper alloy at a cooling rate of 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at a temperature of 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at a temperature of 300 to 600° C.
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公开(公告)号：US20170122681A1
公开(公告)日：2017-05-04
申请号：US15278340
申请日：2016-09-28
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： F28F21/08 , C22C9/02 , B21B3/00 , H01L23/373 , H01L21/48 , C22F1/08 , H01L23/367
CPC分类号： F28F21/085 , B21B3/00 , B21B2003/005 , B21B2261/22 , C22C9/02 , C22F1/08 , H01L21/4878 , H01L23/367 , H01L23/3736
摘要： In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1−L0) is 0.5 to 2.0 m assuming that L0 is a distance between a roll at the last sending side of the leveler 14 and a roll at the first entrance side of the feeder 16 and that L1 is the length of the strip 12 between the roll at the last sending side of the leveler 14 and the roll at the first entrance side of the feeder 16.
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公开(公告)号：US11293084B2
公开(公告)日：2022-04-05
申请号：US16345298
申请日：2017-10-24
摘要： An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900° C. to 400° C.; cooling the hot-rolled copper alloy at 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600° C.
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公开(公告)号：US10180293B2
公开(公告)日：2019-01-15
申请号：US15278340
申请日：2016-09-28
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： B21B3/00 , C22C9/02 , C22F1/08 , F28F21/08 , H01L21/48 , H01L23/367 , H01L23/373
摘要： A method for producing a heat radiating plate, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler to obtain a strip; causing the strip to pass through a gap between the rolls of a leveler to correct the shape thereof; progressively feeding the corrected strip to a progressive die via a feeder to progressively press-working the strip to produce a heat radiating plate.
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公开(公告)号：US12049690B2
公开(公告)日：2024-07-30
申请号：US17602391
申请日：2020-01-30
摘要： There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
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公开(公告)号：US11285701B2
公开(公告)日：2022-03-29
申请号：US16800833
申请日：2020-02-25
发明人： Meoung-whan Cho , Il-ho Kim , Seog-woo Lee , Young-suk Kim , Hiroto Narieda , Tomotsugu Aoyama
IPC分类号： B32B15/20 , B32B15/01 , C22C9/00 , F28F21/08 , H01L23/373
摘要： A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
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公开(公告)号：US10745787B2
公开(公告)日：2020-08-18
申请号：US15760693
申请日：2016-08-29
摘要： A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NA Of fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mm2 or more and a ratio NB/NA of a number density NB (per 0.012 mm2) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the NA of 0.50 or less.
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