Invention Application
- Patent Title: VANE ARC SEGMENT WITH THERMAL INSULATION ELEMENT
-
Application No.: US17102575Application Date: 2020-11-24
-
Publication No.: US20220162945A1Publication Date: 2022-05-26
- Inventor: Raymond Surace , Mark F. Zelesky
- Applicant: RAYTHEON TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Main IPC: F01D5/08
- IPC: F01D5/08 ; F01D5/28 ; F01D5/14 ; F01D5/18 ; F02C7/24 ; F02C7/06

Abstract:
A vane arc segment includes an airfoil piece that defines first and second platforms and an airfoil section that extends between the first and second platforms. The first platform defines a gaspath side, a non-gaspath side, and a first platform radial flange that projects from the non-gaspath side. Support hardware supports the airfoil piece via the first platform radial flange. A thermal insulation element is situated adjacent the first platform radial flange. The support hardware supports the airfoil piece through the thermal insulation element.
Public/Granted literature
- US11536148B2 Vane arc segment with thermal insulation element Public/Granted day:2022-12-27
Information query