Invention Application
- Patent Title: DIGITAL IMMUNOCHIP AND MANUFACTURE METHOD OF THE SAME
-
Application No.: US17355338Application Date: 2021-06-23
-
Publication No.: US20220163516A1Publication Date: 2022-05-26
- Inventor: Haonan LIU , Yudan YIN , Ding DING
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN202011349414.7 20201126
- Main IPC: G01N33/543
- IPC: G01N33/543 ; B01L3/00

Abstract:
The present disclosure provides a digital immunochip and a manufacture method thereof. The digital immunochip includes a first substrate and a second substrate which are opposite to each other. The first substrate includes: a first base substrate; at least one driving electrode on the first base substrate and configured to drive an object to be detected to move; a dielectric layer on a side of the at least one driving electrode away from the first base substrate and covering the at least one driving electrode; and a first hydrophobic layer on a side of the dielectric layer away from the first base substrate. The second substrate includes: a second base substrate; and an immunoassay substance on a side of the second base substrate proximal to the first hydrophobic layer of the first substrate and including an antigen or an antibody.
Public/Granted literature
- US11913947B2 Digital immunochip and manufacture method of the same Public/Granted day:2024-02-27
Information query
IPC分类: