Invention Application
- Patent Title: COIL COMPONENT
-
Application No.: US17180086Application Date: 2021-02-19
-
Publication No.: US20220165486A1Publication Date: 2022-05-26
- Inventor: Ye Ji Jung , Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0160819 20201126
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32 ; H01F17/00

Abstract:
A coil component includes: a body; a coil unit disposed in the body; a support substrate unit in contact with the coil unit to support the coil unit, and including first and second support substrates spaced apart from and oppose each other; and first and second external electrodes disposed on a first surface of the body and spaced apart from each other, and respectively connected to the coil unit.
Public/Granted literature
- US12119165B2 Coil component Public/Granted day:2024-10-15
Information query