Invention Application
- Patent Title: MANUFACTURING METHOD OF PACKAGE DEVICE
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Application No.: US17315389Application Date: 2021-05-10
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Publication No.: US20220165628A1Publication Date: 2022-05-26
- Inventor: Yeong-E CHEN , Kuang-Chiang HUANG , Yu-Ting LIU , Yi-Hung LIN , Cheng-En CHENG
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Priority: CN202011353826.8 20201126
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00 ; H01L21/48

Abstract:
The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.
Public/Granted literature
- US11798853B2 Manufacturing method of package device Public/Granted day:2023-10-24
Information query
IPC分类: