公开(公告)号：US20240006249A1

公开(公告)日：2024-01-04

申请号：US18369847

申请日：2023-09-19

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Yi-Hung LIN ,  Cheng-En CHENG

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L22/14 ,  H01L22/32 ,  H01L24/19 ,  H01L21/48 ,  H01L24/82 ,  H01L2224/829

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

公开(公告)号：US20230282969A1

公开(公告)日：2023-09-07

申请号：US18315662

申请日：2023-05-11

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC: H01Q1/36 ,  H01Q9/04

CPC classification number: H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

Abstract: An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.

公开(公告)号：US20230145304A1

公开(公告)日：2023-05-11

申请号：US17749016

申请日：2022-05-19

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Chun-Chin FAN

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L21/4857 ,  H01L21/4853 ,  H01L2224/13021 ,  H01L2224/13144 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13176 ,  H01L2224/13124 ,  H01L2224/13157 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1318 ,  H01L2224/13149 ,  H01L2224/13118 ,  H01L2224/13578 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/1369 ,  H01L24/16 ,  H01L2224/16238 ,  H01L2224/1182 ,  H01L24/11 ,  H01L2221/68345 ,  H01L21/6835

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.

公开(公告)号：US20220397542A1

公开(公告)日：2022-12-15

申请号：US17748531

申请日：2022-05-19

Applicant: InnoLux Corporation

Inventor： Fuh-Tsang WU ,  Yi-Hung LIN ,  Huei-Ying CHEN

IPC: G01N27/12 ,  G01N27/07 ,  G01N27/06

Abstract: A liquid detection device and a method for manufacturing the same are provided. The liquid detection device includes: a substrate; a working electrode disposed on the substrate, wherein the working electrode includes a first metal portion and a first sensing portion, and the first sensing portion is disposed on the first metal portion; and a reference electrode disposed on the substrate.

公开(公告)号：US20190051979A1

公开(公告)日：2019-02-14

申请号：US16047127

申请日：2018-07-27

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chin-Lung TING ,  Hui-Min HUANG ,  Tang-Chin HUNG

IPC: H01Q1/36 ,  H01Q1/40

Abstract: A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.

公开(公告)号：US20220087030A1

公开(公告)日：2022-03-17

申请号：US16953338

申请日：2020-11-20

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan CHOU ,  Yi-Hung LIN

IPC: H05K3/02 ,  H05K3/00

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US20200091594A1

公开(公告)日：2020-03-19

申请号：US16546504

申请日：2019-08-21

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC: H01Q1/36 ,  H01Q9/04

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US20180375200A1

公开(公告)日：2018-12-27

申请号：US15788888

申请日：2017-10-20

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Yi-Hung LIN ,  Chin-Lung TING ,  Tang-Chin HUNG ,  Jeng-Nan LIN

IPC: H01Q1/36

Abstract: An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

公开(公告)号：US20240405414A1

公开(公告)日：2024-12-05

申请号：US18806879

申请日：2024-08-16

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC: H01Q1/36 ,  H01Q3/44 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a substrate and a plurality of units disposed on the substrate. A portion of the plurality of units includes a conductive layer and an insulating layer. The conductive layer has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. Moreover, a width of the first opening of the conductive layer is greater than a width of the second opening of the insulating layer.

公开(公告)号：US20230245949A1

公开(公告)日：2023-08-03

申请号：US17898410

申请日：2022-08-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC: H01L23/44 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L23/44 ,  H05K1/0209 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0753 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/12041 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/064

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.