Invention Application
- Patent Title: ASSEMBLY STRUCTURE AND METHODS FOR MANUFACTURING THE SAME
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Application No.: US17105277Application Date: 2020-11-25
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Publication No.: US20220165683A1Publication Date: 2022-05-26
- Inventor: Wen Hung HUANG , Yu-Ju LIAO
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/52 ; H01L21/56
Abstract:
An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.
Public/Granted literature
- US11848280B2 Method for manufacturing assembly structure by using frame structure on substrate Public/Granted day:2023-12-19
Information query
IPC分类:
