Invention Application
- Patent Title: WAFER ALIGNMENT FEATURES
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Application No.: US17436803Application Date: 2020-03-11
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Publication No.: US20220168978A1Publication Date: 2022-06-02
- Inventor: Nicola Spring , Uros Markovic
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- International Application: PCT/SG2020/050127 WO 20200311
- Main IPC: B29D11/00
- IPC: B29D11/00 ; G02B3/00 ; G02B5/18

Abstract:
A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (200) by capillary action.
Information query