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公开(公告)号:US20220227080A1
公开(公告)日:2022-07-21
申请号:US17608652
申请日:2020-06-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor: Uros Markovic , Nicola Spring
Abstract: Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).
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公开(公告)号:US20210394470A1
公开(公告)日:2021-12-23
申请号:US17288735
申请日:2019-11-01
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor: Uros Markovic
Abstract: A method includes: providing a substrate, in which a first surface of the substrate includes at least one optical element module region defining an area in which multiple optical elements are to be disposed; forming, for each optical element module region on the first surface of the substrate, a corresponding reflow waste channel in the first surface of the substrate and around a perimeter of the optical element module region; providing a first optical element mold, in which a surface of the first optical element mold includes multiple first cavities, each first cavity defining a shape of a corresponding optical element of the multiple optical elements; providing resin globules between the surface of the optical element mold and the first surface of the substrate; and compressing the first optical element mold to the first surface of the substrate so that the resin fills the multiple first cavities, and so that excess resin flows into the reflow waste channel.
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公开(公告)号:US11897213B2
公开(公告)日:2024-02-13
申请号:US17608652
申请日:2020-06-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor: Uros Markovic , Nicola Spring
CPC classification number: B29D11/00375 , G02B3/0031 , G02B3/0056
Abstract: Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).
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公开(公告)号:US20220227081A1
公开(公告)日:2022-07-21
申请号:US17614738
申请日:2020-05-19
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor: Tae Yong Ahn , Sai Mun Chan , Lorenzo Tonsa , Lili Chong , Woei Quan Kong , Chitra Nadimuthu , Kay Khine Aung , Herng Wei Pook , Uros Markovic
Abstract: Flow barriers such as trenches (144) and/or walls (152) laterally surrounding an aperture (142) in a coating (140) on a transparent substrate (120) help control the flow of replication material (124) during the formation of a replicated optical element on the aperture (142).
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公开(公告)号:US20220168978A1
公开(公告)日:2022-06-02
申请号:US17436803
申请日:2020-03-11
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor: Nicola Spring , Uros Markovic
Abstract: A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (200) by capillary action.
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