Invention Application
- Patent Title: RESIN PARTICLE
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Application No.: US17321902Application Date: 2021-05-17
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Publication No.: US20220169833A1Publication Date: 2022-06-02
- Inventor: Kenji YAO , Hideaki YOSHIKAWA , Masahiro OKI , Kazusei YOSHIDA , Tetsuya TAGUCHI
- Applicant: FUJIFILM BUSINESS INNOVATION CORP.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee Address: JP Tokyo
- Priority: JP2020-198972 20201130
- Main IPC: C08L1/12
- IPC: C08L1/12 ; C08L1/14 ; C08K5/05 ; C08L67/02 ; C08L77/00 ; C08K5/11
Abstract:
[Problem] To provide a resin particle having excellent heat resistance and flexibility.
[Solution] A resin particle in which a mass loss rate after being immersed in distilled water at 70° C. for 14 days is less than 10%, and in which a mass loss rate after being left in a compost having a composition shown below at 55° C. for 14 days is 90% or more.
[Solution] A resin particle in which a mass loss rate after being immersed in distilled water at 70° C. for 14 days is less than 10%, and in which a mass loss rate after being left in a compost having a composition shown below at 55° C. for 14 days is 90% or more.
Information query
