Invention Application
- Patent Title: PRESSURE-SENSITIVE ADHESIVE COMPOSITION WITH TRANSPARENCY CHARACTERISTICS
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Application No.: US17442410Application Date: 2020-03-20
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Publication No.: US20220169897A1Publication Date: 2022-06-02
- Inventor: Frank Kuester , Silke D. Mechernich , Kerstin Unverhau , Tom Opstal
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Priority: EP19165510.9 20190327
- International Application: PCT/IB2020/052629 WO 20200320
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C09J133/08 ; C09J7/24

Abstract:
The present disclosure relates to a pressure sensitive adhesive composition comprising a blend of: a) a (meth)acrylate-based (co)polymer base component; and b) a (meth)acrylate-based copolymeric additive comprising the free-radical random copolymerization reaction product of a copolymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. greater than 10 wt. % of C1-C18 methacrylic acid ester monomer units, based on the total weight of the (meth)acrylate-based copolymeric additive; and iii. ethylenically unsaturated monomer units having a functional group, which are copolymerizable with monomer units (i) and/or (ii); wherein the (meth)acrylate-based copolymeric additive has a weight average molecular weight (Mw) greater than 10,000 Daltons and a Tg no greater than 50° C., as estimated by the Fox equation. According to another aspect, the present disclosure is directed to a multilayer pressure sensitive adhesive assembly comprising at least a first polymer layer and a second pressure sensitive adhesive layer adjacent to the first polymer layer, wherein the second pressure sensitive adhesive layer has a composition as described above. According to still another aspect of the present disclosure, it is provided a method for manufacturing a pressure sensitive adhesive composition as described above. In yet another aspect, the present disclosure relates to the use of a pressure sensitive adhesive composition or multilayer pressure sensitive adhesive assembly as described above for the bonding to a medium surface energy substrate or a high surface energy substrate.
Information query
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