Invention Application
- Patent Title: IMPLANTED ISOLATION FOR DEVICE INTEGRATION ON A COMMON SUBSTRATE
-
Application No.: US17109538Application Date: 2020-12-02
-
Publication No.: US20220173233A1Publication Date: 2022-06-02
- Inventor: Siva P. Adusumilli , Mark Levy , Jeonghyun Hwang
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/66 ; H01L29/04 ; H01L27/088 ; H01L29/16

Abstract:
Structures including devices, such as transistors, integrated on a semiconductor substrate and methods of forming a structure including devices, such as transistors, integrated on a semiconductor substrate. A first transistor is formed in a first device region of a semiconductor substrate, and a second transistor is formed in a second device region of the semiconductor substrate. The second transistor includes a layer stack on the semiconductor substrate, and the layer stack includes a layer comprised of a III-V compound semiconductor material. A polycrystalline layer includes a section that is positioned in the semiconductor substrate beneath the first device region.
Public/Granted literature
- US11569374B2 Implanted isolation for device integration on a common substrate Public/Granted day:2023-01-31
Information query
IPC分类: