Invention Application
- Patent Title: OPTICAL NETWORK ON CHIP FOR PROCESSOR COMMUNICATION
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Application No.: US17107212Application Date: 2020-11-30
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Publication No.: US20220173825A1Publication Date: 2022-06-02
- Inventor: LUCA RAMINI , Jinsung YOUN , Steven DEAN , Marco FIORENTINO
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Main IPC: H04J14/02
- IPC: H04J14/02 ; H04B10/27

Abstract:
An optical network on chip comprises a first optical communication link and a second communication optical link. The first communication optical link comprises a plurality of first wavelength division multiplexers (WDMs) coupled to a first processor, a plurality of second WDMs coupled to a second processor, and a plurality of first optical interconnects coupled between the plurality of first WDMs and the plurality of second WDMs. The second optical communication link comprises a plurality of first serializer-deserializers (SerDes) coupled to the first processor at one end and coupled to a plurality third WDMs at the other end, a plurality of second SerDes coupled to a memory component at one end and coupled to a plurality of fourth WDMs at the other end, and a plurality of second optical interconnects coupled between the plurality of third WDMs and the plurality of fourth WDMs.
Information query