公开(公告)号：US20240027708A1

公开(公告)日：2024-01-25

申请号：US17867862

申请日：2022-07-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey John LUNSMAN ,  Steven DEAN

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20418 ,  H05K7/2049 ,  H05K7/20254

Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

公开(公告)号：US20220173825A1

公开(公告)日：2022-06-02

申请号：US17107212

申请日：2020-11-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： LUCA RAMINI ,  Jinsung YOUN ,  Steven DEAN ,  Marco FIORENTINO

IPC: H04J14/02 ,  H04B10/27

Abstract: An optical network on chip comprises a first optical communication link and a second communication optical link. The first communication optical link comprises a plurality of first wavelength division multiplexers (WDMs) coupled to a first processor, a plurality of second WDMs coupled to a second processor, and a plurality of first optical interconnects coupled between the plurality of first WDMs and the plurality of second WDMs. The second optical communication link comprises a plurality of first serializer-deserializers (SerDes) coupled to the first processor at one end and coupled to a plurality third WDMs at the other end, a plurality of second SerDes coupled to a memory component at one end and coupled to a plurality of fourth WDMs at the other end, and a plurality of second optical interconnects coupled between the plurality of third WDMs and the plurality of fourth WDMs.

公开(公告)号：US20240032249A1

公开(公告)日：2024-01-25

申请号：US17867873

申请日：2022-07-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Steven DEAN ,  Ernesto J. FERRER ,  John Paul FRANZ ,  Laura MALCOTTI-SANCHEZ

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/20336

Abstract: A heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. The folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are part of the vapor chamber. The second plurality of grooves are part of the liquid chamber.