- 专利标题： TAPE LAYUP APPARATUS AND TAPE LAYUP METHOD
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申请号： US17436760申请日： 2020-03-02
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公开(公告)号： US20220176643A1公开(公告)日： 2022-06-09
- 发明人: Naoyuki ATSUTA , Takashi IWADE , Jun INAGAKI , Toshifumi TAKEGAMI , Kotaro TADANO
- 申请人： TORAY ENGINEERING CO., LTD. , TOKYO INSTITUTE OF TECHNOLOGY
- 申请人地址： JP Tokyo; JP Tokyo
- 专利权人： TORAY ENGINEERING CO., LTD.,TOKYO INSTITUTE OF TECHNOLOGY
- 当前专利权人： TORAY ENGINEERING CO., LTD.,TOKYO INSTITUTE OF TECHNOLOGY
- 当前专利权人地址： JP Tokyo; JP Tokyo
- 优先权： JP2019-042638 20190308,JP2020-034580 20200302
- 国际申请： PCT/JP2020/008584 WO 20200302
- 主分类号： B29C65/50
- IPC分类号： B29C65/50 ; B29C70/38
摘要：
A tape layup apparatus whereby the tape layup performance on a surface to be laid up can be enhanced is provided, the tape layup apparatus being an ATL apparatus 10 having an ATL head 20 for laying up with pressing a tape 1 on a laid-up surface 2a, the ATL head 20 equipped with a pressing part 30 to press the tape 1 on the laid-up surface 2a and a parallel linkage 40 to operate in a manner that allows a pressing position and/or a pressing attitude of the pressing part 30 to follow a form of the laid-up surface 2a.