发明申请
- 专利标题： CONTACT STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CONTACT STRUCTURE
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申请号： US17116135申请日： 2020-12-09
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公开(公告)号： US20220177717A1公开(公告)日： 2022-06-09
- 发明人: Zhi-Qiang Lin , Yi-Min Jiang , Shen-Jie Chen , Ting-Ting Li , Xi-Zhao Wang , Li-Wei Mu , Shan-Yu Wu , Chih-Min Chen , Chao-Hui Kuo
- 申请人： TPK Advanced Solutions Inc.
- 申请人地址： CN Xiamen
- 专利权人： TPK Advanced Solutions Inc.
- 当前专利权人： TPK Advanced Solutions Inc.
- 当前专利权人地址： CN Xiamen
- 主分类号： C09D7/63
- IPC分类号： C09D7/63 ; G06F3/041 ; G03F7/16 ; C23C30/00
摘要：
A contact structure is provided, which includes a substrate, a copper layer, an organic composite protective layer, and a nanosilver layer. The copper layer is disposed over the substrate. The organic composite protective layer is disposed over the copper layer to avoid oxidation of the copper layer, in which the organic composite protective layer forms a monomolecular adsorption layer over a surface of the copper layer. The nanosilver layer is disposed over the organic composite protective layer. A method of manufacturing a contact structure is also provided.
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