Invention Application
- Patent Title: FIBER SHEET, AND LAYERED BODY, CIRCUIT BOARD AND ELECTRONIC BOARD USING SAME
-
Application No.: US17441492Application Date: 2020-03-26
-
Publication No.: US20220183154A1Publication Date: 2022-06-09
- Inventor: Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2019-061650 20190327
- International Application: PCT/JP2020/013827 WO 20200326
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
Public/Granted literature
- US12273996B2 Fiber sheet, and layered body, circuit board and electronic board using same Public/Granted day:2025-04-08
Information query
