Invention Application
- Patent Title: COIL COMPONENT
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Application No.: US17545629Application Date: 2021-12-08
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Publication No.: US20220189682A1Publication Date: 2022-06-16
- Inventor: Masataro SAITO , Hokuto EDA , Kohei TAKAHASHI , Takamasa IWASAKI , Masazumi ARATA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2020-205811 20201211
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32 ; H01F17/04
Abstract:
By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.
Public/Granted literature
- US12217902B2 Coil component Public/Granted day:2025-02-04
Information query
