Invention Application
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC LAYER AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17317663Application Date: 2021-05-11
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Publication No.: US20220189972A1Publication Date: 2022-06-16
- Inventor: Jae Gil LEE , Dong Ik SUH , Se Ho LEE
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Priority: KR10-2020-0175878 20201215
- Main IPC: H01L27/1159
- IPC: H01L27/1159 ; G11C11/22

Abstract:
A semiconductor device according to an embodiment includes a substrate, a bit line structure and a source line structure respectively extending in a direction perpendicular to a surface of the substrate, a semiconductor layer disposed between the bit line structure and the source line structure on a plane parallel to the surface of the substrate, a first ferroelectric layer disposed on a first surface of the semiconductor layer, and a first gate electrode layer disposed on the first ferroelectric layer.
Public/Granted literature
- US11792995B2 Semiconductor device including ferroelectric layer and method of manufacturing the same Public/Granted day:2023-10-17
Information query
IPC分类: