Invention Application
- Patent Title: LOCAL COOLING DEVICE AND LOCAL COOLING METHOD
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Application No.: US17603111Application Date: 2020-04-13
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Publication No.: US20220192057A1Publication Date: 2022-06-16
- Inventor: Koichi TODOROKI , Minoru YOSHIKAWA , Kunihiko ISHIHARA , Masaki CHIBA , Yoshinori MIYAMOTO , Takafumi NATSUMEDA , Nirmal Singh RAJPUT
- Applicant: NEC Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Priority: JP2019-084385 20190425
- International Application: PCT/JP2020/016282 WO 20200413
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K7/14

Abstract:
A local cooler includes: a housing formed into a box shape; a heat exchanger provided along a slope extending upward to a rear portion from a lower position located on the front side of the housing; a first intake/exhaust port provided on a front surface of the housing; a second intake/exhaust port provided on a bottom surface of the housing; third intake/exhaust ports provided at a plurality of locations among side surfaces, upper surface and rear surface of the housing; and a closing plate capable of selectively shielding these intake/exhaust ports.
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