An example method of joining a first structure and a second structure is described that includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.