Invention Application
- Patent Title: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE THEREIN AND CORRESPONDING SEMICONDUCTOR DEVICE
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Application No.: US17550925Application Date: 2021-12-14
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Publication No.: US20220199500A1Publication Date: 2022-06-23
- Inventor: Mauro MAZZOLA , Roberto TIZIANI
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Priority: IT102020000031553 20201218
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48
Abstract:
A leadframe includes a pattern of electrically-conductive formations with one or more sacrificial connection formations extending bridge-like between a pair of electrically-conductive formations. The sacrificial connection formation or formations are formed at one of the first surface and the second surface of the leadframe and have a thickness less than the leadframe thickness between the first surface and the second surface. A filling of electrically-insulating material is molded between the electrically-conductive formations of the leadframe, with electrically-insulating material molded between the connection formation(s) and the other surface of the leadframe. The sacrificial connection formation(s) counter deformation and displacement of parts during formation and pre-molding of the leadframe.
Information query
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