公开(公告)号：US20240145351A1

公开(公告)日：2024-05-02

申请号：US18384524

申请日：2023-10-27

Applicant: STMicroelectronics S.r.l.

Inventor： Matteo DE SANTA ,  Mauro MAZZOLA

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/49548 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H05K1/181 ,  H05K3/3426 ,  H01L21/561

Abstract: A semiconductor die is arranged on a first surface of a leadframe having a first thickness between the first surface and a second surface opposite the first surface and an array of electrically conductive leads. Terminal recesses are provided in the electrically conductive leads in the array at the first surface. At the terminal recesses, the electrically conductive leads have a second thickness less than the first thickness. The semiconductor die is coupled with the electrically conductive leads via wires or ribbons having ends coupled to the electrically conductive leads arranged in the terminal recesses. The leadframe is partially cut starting from the second surface at the terminal recesses with a cutting depth between the first thickness and the second thickness. The partial cut produces exposed surfaces of the electrically conductive leads and the ends of the electrically conductive elongated formations providing wettable flanks for solder material.

公开(公告)号：US20230031356A1

公开(公告)日：2023-02-02

申请号：US17873967

申请日：2022-07-26

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Roberto TIZIANI

IPC: H01L21/48 ,  H01L23/495

Abstract: A pre-molded leadframe includes a laminar structure having empty spaces therein and a first thickness with a die pad having opposed first and second die pad surfaces. Insulating pre-mold material is molded onto the laminar structure. The pre-mold material penetrates the empty spaces and provides a laminar pre-molded substrate having the first thickness with the first die pad surface left exposed. The die pad has a second thickness that is less than the first thickness. One or more pillar formations are provided protruding from the second die pad surface to a height equal to a difference between the first and second thicknesses. With the laminar structure clamped between surfaces of a mold, the first die pad surface and pillar formations abut against the mold surfaces. The die pad is thus effectively clamped between the clamping surfaces countering undesired flashing of the pre-mold material over the first die pad surface.

公开(公告)号：US20230005825A1

公开(公告)日：2023-01-05

申请号：US17848493

申请日：2022-06-24

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: Semiconductor chips to be singulated to individual semiconductor devices are arranged onto respective adjacent areas of a mounting substrate such as a pre-molded leadframe. The mounting substrate is made of a laminar, electrically conductive sculptured structure with molded electrically insulating material. Electrically conductive side formations in the adjacent areas of the mounting substrate include first and second pads at front and back surfaces, respectively, of the mounting substrate. The first contact pads at the front surface of the substrate include narrowed portions having side recesses. The second contact pads at the back surface of the substrate include widened portions having side extensions adjacent the side recesses. The electrically insulating material extends into the side recesses to provide anchoring formations of the insulating material to the electrically conductive sculptured structure of the mounting substrate.

公开(公告)号：US20240178105A1

公开(公告)日：2024-05-30

申请号：US18516707

申请日：2023-11-21

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Roberto TIZIANI ,  Mauro MAZZOLA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/4828 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245

Abstract: Electrically insulating material such as an epoxy resin is molded onto a sculptured, electrically conductive leadframe structure comprising a pattern of electrically conductive formations. The electrically insulating material penetrates into spaces between electrically conductive formations in the pattern of electrically conductive formations to provide a pre-molded leadframe structure configured to have at least one semiconductor die arranged thereon. The pre-molded leadframe structure has opposed first and second surfaces and a pre-molded leadframe thickness between the first surface and the second surface. The sculptured, electrically conductive leadframe structure comprises one or more connection formations connected with electrically conductive formations in the pattern of electrically conductive formations. The connection formation or formations have a first thickness equal to the thickness between the first surface and the second surface. The thickness of the connection formation or formations is reduced from the first thickness to a second, reduced uniform thickness with exposed wettable flanks formed in the electrically conductive formations facing the connection formation or formations with reduced thickness.

公开(公告)号：US20230049088A1

公开(公告)日：2023-02-16

申请号：US17881921

申请日：2022-08-05

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/495

Abstract: A semiconductor device includes a pre-molded leadframe mounting substrate. The substrate includes a die pad (configured to have a semiconductor die mounted thereon) and a first electrically conductive pad and a second electrically conductive pad. A strip of insulating material is molded between the first and second electrically conductive pads to provide a mutually electrically insulation and extends in a longitudinal direction with the first electrically conductive pad and the second electrically conductive pad lying on opposite sides of the strip of insulating material. A semiconductor die is arranged on the die pad in register with the strip of insulating material. A single electrically conductive ribbon extending in register with the strip of insulating material electrically couples the semiconductor die with both the first and second electrically conductive pads to provide a common current flow path from the semiconductor die towards the first and the second electrically conductive pads.

公开(公告)号：US20210375726A1

公开(公告)日：2021-12-02

申请号：US17324436

申请日：2021-05-19

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Matteo DE SANTA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/50

Abstract: In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

公开(公告)号：US20230245994A1

公开(公告)日：2023-08-03

申请号：US18102147

申请日：2023-01-27

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Fabio MARCHISI

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L24/40 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/73 ,  H01L23/4952 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/40177 ,  H01L2224/32245 ,  H01L2224/73263 ,  H01L2224/40505 ,  H01L2224/83 ,  H01L2224/84801 ,  H01L2224/92246

Abstract: A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

公开(公告)号：US20230031422A1

公开(公告)日：2023-02-02

申请号：US17871203

申请日：2022-07-22

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L21/48 ,  H01L23/495

Abstract: A pre-molded substrate includes a sculptured, electrically conductive laminar structure having spaces therein. The laminar structure includes a die pad having a first die pad surface configured to mount a semiconductor chip. A pre-mold material molded onto the laminar structure penetrates into the spaces and provides a laminar pre-molded substrate with the first die pad surface left exposed. The peripheral edge of the die pad includes an alternation of first and second anchoring formations to the pre-mold material. The first anchoring formations counter first detachment forces inducing displacement of the die pad with respect to the pre-mold material in a first direction from the second die pad surface to the first die pad surface. The second anchoring formations counter second detachment forces inducing displacement of the die pad with respect to the pre-mold material in a second direction from the first die pad surface to the second die pad surface.

公开(公告)号：US20230005824A1

公开(公告)日：2023-01-05

申请号：US17848612

申请日：2022-06-24

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L23/495 ,  H01L21/48

Abstract: Pre-molded leadframes for semiconductor devices are manufactured by molding electrically insulating material onto a laminar sculptured structure of electrically conductive material including semiconductor device component die pads. First and second die pads are coupled via a first extension from the first die pad and a second extension from the second die pad at neighboring locations on the front surface of the leadframe and a bridge formation coupling the first and second extensions at the bacpk surface of the leadframe. The bridge formation provides a sacrificial connection between the first and second extensions which is selectively removed after molding the electrically insulating material in order to decouple the first and second die pads from each other. The removal of the sacrificial connection leaves a cavity formed at the second surface of the leadframe without affecting the shape of the die pads.

公开(公告)号：US20210193591A1

公开(公告)日：2021-06-24

申请号：US17126880

申请日：2020-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto TIZIANI ,  Mauro MAZZOLA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A leadframe for semiconductor devices, the leadframe comprising a die pad portion having a first planar die-mounting surface and a second planar surface opposed the first surface, the first surface and the second surface having facing peripheral rims jointly defining a peripheral outline of the die pad wherein the die pad comprises at least one package molding compound receiving cavity opening at the periphery of said first planar surface.