MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

Invention Application

US20220199575A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES 有权

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Patent Title: MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Application No.: US17126505

Application Date: 2020-12-18
Publication No.: US20220199575A1

Publication Date: 2022-06-23
Inventor: Omkar G. Karhade , Bohan Shan
Applicant: Intel Corporation
Applicant Address: US CA Santa Clara
Assignee: Intel Corporation
Current Assignee: Intel Corporation
Current Assignee Address: US CA Santa Clara
Main IPC: H01L25/065
IPC: H01L25/065 ; H01L23/538 ; H01L23/00

Abstract:

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Public/Granted literature

US12119326B2 Microelectronic structures including bridges Public/Granted day:2024-10-15

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L25/00	由多个单个半导体或其他固态器件组成的组装件（在一共用基片内或其上形成的由多个固态组件组成的器件入H01L 27/00；光伏电池的光伏模块或者阵列入H01L 31/042）
H01L25/03	.所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件
H01L25/04	..不具有单独容器的器件
H01L25/065	...包含在H01L27/00组类型的器件