- 专利标题: CONNECTION STRUCTURE FOR SUPERCONDUCTING LAYER, SUPERCONDUCTING WIRE, SUPERCONDUCTING COIL, SUPERCONDUCTING DEVICE, AND CONNECTION METHOD FOR SUPERCONDUCTING LAYER
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申请号: US17689861申请日: 2022-03-08
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公开(公告)号: US20220199887A1公开(公告)日: 2022-06-23
- 发明人: Masaya Hagiwara , Tomoko Eguchi , Keiko Albessard , Yasushi Hattori
- 申请人: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
- 申请人地址: JP Tokyo; JP Kawasaki-shi Kanagawa
- 专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
- 当前专利权人地址: JP Tokyo; JP Kawasaki-shi Kanagawa
- 优先权: JP2020-147013 20200901
- 主分类号: H01L39/12
- IPC分类号: H01L39/12 ; H01L39/24 ; H01F6/06 ; H01R4/68
摘要:
A connection structure for a superconducting layer according to an embodiment includes a first superconducting layer; a second superconducting layer; and a connection layer disposed between the first superconducting layer and the second superconducting layer, the connection layer including crystal grains containing a rare earth element (RE), barium (Ba), copper (Cu), and oxygen (O), the crystal grains having a grain size distribution including a bimodal distribution. The bimodal distribution includes a first distribution including a first peak and a second distribution including a second peak. A first grain size corresponding to the first peak is larger than a second grain size corresponding to the second peak. Among the crystal grains, crystal grains having a grain size corresponding to the first distribution include a crystal grain having a plate shape or a flat shape.
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