A radio-frequency module includes a module substrate having a major surface on which a ground electrode pattern is formed and an integrated circuit disposed on the major surface of the module substrate. The integrated circuit includes a control/power supply circuit having at least one of a control circuit and a power supply circuit and a second electrical circuit having at least one of an amplifier, a switch, and a filter. In plan view, the ground electrode pattern overlaps at least a part of the control/power supply circuit and does not overlap at least a part of the second electrical circuit.