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    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
    2.
    发明申请
    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE 有权

    公开(公告)号：US20210143854A1

    公开(公告)日：2021-05-13

    申请号：US17153917

    申请日：2021-01-21

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takashi WATANABE

    IPC: H04B1/16 ,  H03H7/38 ,  H03H9/64 ,  H03H9/72 ,  H03H11/36

    Abstract: A radio-frequency module includes a first terminal configured to receive a signal from an antenna, a substrate, a first filter element on the substrate, a first switch including a first switch terminal and a second switch terminal connectable to the first switch terminal, and connected between the first terminal and the first filter element, and a second switch including a third switch terminal. The first filter element is connected between the second switch terminal and the third switch terminal, the first switch and the second switch are included in a semiconductor chip, and the semiconductor chip is on the substrate.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
    3.
    发明申请
    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE 审中-公开

    公开(公告)号：US20200106466A1

    公开(公告)日：2020-04-02

    申请号：US16702712

    申请日：2019-12-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takashi WATANABE

    IPC: H04B1/16 ,  H03H7/38 ,  H03H9/64 ,  H03H9/72 ,  H03H11/36

    Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

    ARITHMETIC CIRCUIT AND ARITHMETIC PROGRAM
    4.
    发明申请
    ARITHMETIC CIRCUIT AND ARITHMETIC PROGRAM 有权

    公开(公告)号：US20250013794A1

    公开(公告)日：2025-01-09

    申请号：US18891291

    申请日：2024-09-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tomoshige FURUHI ,  Takashi WATANABE ,  Takashi HAGA ,  Takehiko IIZUKA ,  Nobuyuki NOZAWA ,  Jun MAKINO

    IPC: G06F30/10 ,  G06F17/16

    Abstract: An arithmetic circuit according to the present disclosure performs a signal value acquisition step of acquiring X-axis bending values, Y-axis bending values, and twisting values at respective one or more first times before an impact time identified in a time identification step and at respective one or more second times after the impact time; and a first calculation step of calculating one or more parameters indicating a state of an object to be measured at the impact time by multiplying a plurality of the X-axis bending values, a plurality of the Y-axis bending values, and a plurality of the twisting values acquired in the signal value acquisition step by a matrix.

    DATA PROCESSING APPARATUS AND PROGRAM
    5.
    发明公开
    DATA PROCESSING APPARATUS AND PROGRAM 审中-公开

    公开(公告)号：US20240143284A1

    公开(公告)日：2024-05-02

    申请号：US18410167

    申请日：2024-01-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Jun MAKINO ,  Koji KAWANO ,  Nobuyuki NOZAWA ,  Tomoshige FURUHI ,  Takashi WATANABE ,  Takehiko IIZUKA ,  Kenta AGO

    IPC: G06F7/76

    CPC classification number: G06F7/76

    Abstract: A data processing apparatus includes an arithmetic circuit that performs an acquiring step of acquiring swing data indicating relationship between a physical quantity concerning an amount of deformation of an object to be measured and time, a determining step of determining whether the swing data indicates the physical quantity concerning the amount of deformation of the object to be measured, which occurs when the object to be measured is swung, to determine whether the swing data is to be deleted, and a deleting step of deleting the swing data if it is determined that the swing data does not indicate the physical quantity concerning the amount of deformation of the object to be measured, which occurs when the object to be measured is swung.

    SENSOR UNIT AND SENSOR UNIT ATTACHMENT METHOD
    7.
    发明公开
    SENSOR UNIT AND SENSOR UNIT ATTACHMENT METHOD 审中-公开

    公开(公告)号：US20240068796A1

    公开(公告)日：2024-02-29

    申请号：US18505560

    申请日：2023-11-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takehiko IIZUKA ,  Nobuyuki NOZAWA ,  Tomoshige FURUHI ,  Koji KAWANO ,  Takashi WATANABE ,  Jun MAKINO ,  Kenta AGO

    IPC: G01B7/16

    CPC classification number: G01B7/16

    Abstract: Provided is a sensor unit including a first sensor portion that detects deformation of a measuring target object and a second sensor portion that detects deformation of the measuring target object, in which in a state in which the first sensor portion and the second sensor portion are attached to the measuring target object, the first sensor portion and the second sensor portion are fixed to the measuring target object such that the measuring target object is disposed between the first sensor portion and the second sensor portion in a first direction, and a physical property value of the first sensor portion and a physical property value of the second sensor portion are changed according to first deformation of the measuring target object.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
    9.
    发明申请
    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE 审中-公开

    公开(公告)号：US20180123628A1

    公开(公告)日：2018-05-03

    申请号：US15851902

    申请日：2017-12-22

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takashi WATANABE

    IPC: H04B1/16 ,  H03H11/36 ,  H03H9/64 ,  H03H7/38 ,  H03H9/72

    CPC classification number: H04B1/16 ,  H03H7/38 ,  H03H9/64 ,  H03H9/72 ,  H03H11/362 ,  H03H2007/386 ,  H03H2250/00

    Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

    METHOD OF PRODUCING ELECTRONIC COMPONENTS
    10.
    发明申请
    METHOD OF PRODUCING ELECTRONIC COMPONENTS 有权
    生产电子元件的方法

    公开(公告)号：US20150026973A1

    公开(公告)日：2015-01-29

    申请号：US14334688

    申请日：2014-07-18

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuto OGAWA ,  Takashi WATANABE ,  Junya SHIMAKAWA

    IPC: H05K3/30

    CPC classification number: H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

    Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

    Abstract translation: 一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置的电子部件的制造方法，使得所述基板型端子包括基板主体，所述基板主体包括第一和第二延伸的长方形或大致矩形的第一主面 方向彼此垂直或基本垂直。 该装置设置在第一主表面上。 该方法包括使用第一支撑构件支撑待成为其中多个基板型端子以矩阵状排列的组件的基板，将由第一支撑构件支撑的基板切割成多个基板型端子， 以及将所述装置安装在通过切割获得的所述多个基板型端子中的每一个的所述基板主体的所述第一主表面上。

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