Invention Application
- Patent Title: PHOTOSENSOR AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17432101Application Date: 2020-03-10
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Publication No.: US20220201875A1Publication Date: 2022-06-23
- Inventor: Shunya TAKAHASHI , Hirotaka NAKASHIMA , Jumpei NAKAMURA , Tomonari KAWAKAMI
- Applicant: OMRON Corporation
- Applicant Address: JP KYOTO
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP KYOTO
- Priority: JP2019-048468 20190315
- International Application: PCT/JP2020/010316 WO 20200310
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G01J1/42

Abstract:
Provided is a photosensor in which a cable can be easily mounted on a circuit board. A photosensor [[1]] is provided with: a housing [[2]]; a cable [[5]]; a first circuit board [[3]]; and a second circuit board [[4]]. A through-hole [[24]] is formed in the housing [[2]]. The cable [[5]] is inserted into the through-hole [[24]]. The first circuit board [[3]] and the second circuit board [[4]] are accommodated in the housing [[2]]. The first circuit board [[3]] is provided with a first connector [[34]]. The second circuit board [[4]] has a first portion [[41]] and a second portion [[42]]. The cable [[5]] is soldered to the first portion [[41]]. The second portion [[42]] is provided with a second connector [[44]]. The second connector [[44]] is inserted into the first connector [[34]]. The second circuit board [[4]] connects the cable [[5]] and the first circuit board [[3]].
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