Invention Application
- Patent Title: RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
-
Application No.: US17621906Application Date: 2020-06-26
-
Publication No.: US20220204694A1Publication Date: 2022-06-30
- Inventor: Yune KUMAZAWA , Takuya SUZUKI , Seiji SHIKA , Shunsuke KATAGIRI
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-122268 20190628
- International Application: PCT/JP2020/025141 WO 20200626
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08K5/3415 ; H05K1/02 ; H05K1/03

Abstract:
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): wherein R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.
Public/Granted literature
- US11680139B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device Public/Granted day:2023-06-20
Information query