公开(公告)号：US20220204694A1

公开(公告)日：2022-06-30

申请号：US17621906

申请日：2020-06-26

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Takuya SUZUKI ,  Seiji SHIKA ,  Shunsuke KATAGIRI

IPC: C08G73/10 ,  C08K5/3415 ,  H05K1/02 ,  H05K1/03

Abstract: A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): wherein R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.

公开(公告)号：US20230057045A1

公开(公告)日：2023-02-23

申请号：US17784163

申请日：2020-12-09

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Shunsuke KATAGIRI ,  Takuya SUZUKI ,  Seiji SHIKA ,  Yune KUMAZAWA

IPC: C07C69/75 ,  C08G73/12

Abstract: A compound (A) of the present invention is represented by the formula (1): wherein each R1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the formula (2); and wherein -* represents a bonding hand.

公开(公告)号：US20240279432A1

公开(公告)日：2024-08-22

申请号：US18570322

申请日：2022-06-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Shunsuke KATAGIRI ,  Takuya SUZUKI

IPC: C08K5/3415 ,  C08F22/40 ,  G03F7/029 ,  H05K1/03

CPC classification number: C08K5/3415 ,  C08F22/40 ,  G03F7/029 ,  H05K1/0346

Abstract: An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2):

公开(公告)号：US20230062796A1

公开(公告)日：2023-03-02

申请号：US17784142

申请日：2020-12-09

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Shunsuke KATAGIRI ,  Takuya SUZUKI ,  Seiji SHIKA ,  Yune KUMAZAWA

IPC: C07D307/83 ,  C08F222/40 ,  C08F2/50 ,  C08J5/18

Abstract: The compound (A) is represented by formula (1). R1O—R2—OR1   (1) (In formula (1), each R1 independently represents a group represented by formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R1 is a group represented by formula (2).) (In formula (2), -* represents a bonding hand.)

公开(公告)号：US20230066153A1

公开(公告)日：2023-03-02

申请号：US17784281

申请日：2020-12-09

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Takuya SUZUKI ,  Seiji SHIKA ,  Shunsuke KATAGIRI

IPC: C08F234/00

Abstract: Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

公开(公告)号：US20220204695A1

公开(公告)日：2022-06-30

申请号：US17621926

申请日：2020-06-26

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Takuya SUZUKI ,  Seiji SHIKA ,  Shunsuke KATAGIRI

IPC: C08G73/10 ,  C08K5/3417 ,  H05K1/03 ,  H05K1/02

Abstract: The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). In the formula (1), R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

公开(公告)号：US20220071025A1

公开(公告)日：2022-03-03

申请号：US17424229

申请日：2020-01-17

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Takuya SUZUKI ,  Seiji SHIKA

IPC: H05K3/46 ,  C08F2/50 ,  C08J5/24 ,  C08G73/10 ,  C08G73/12 ,  H05K1/09 ,  H05K1/03

Abstract: A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

公开(公告)号：US20240309127A1

公开(公告)日：2024-09-19

申请号：US18567858

申请日：2022-06-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Shunsuke KATAGIRI ,  Yune KUMAZAWA ,  Takuya SUZUKI

IPC: C08F22/40 ,  G03F7/031 ,  H05K1/03

CPC classification number: C08F22/40 ,  G03F7/031 ,  H05K1/0346

Abstract: An object of the present invention is to provide a resin composition and a resin sheet which have excellent photocurability for an active energy ray including an i-line with a wavelength of 365 nm in an exposure step, and can confer excellent alkaline developability in a development step, in the fabrication of a multilayer printed wiring board; and a high density printed wiring board and semiconductor device having a highly detailed resist pattern using the same. The resin composition of the present invention contains: a maleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and a photo initiator (B) having an absorbance of 2.0 or more at a wavelength of 365 nm (i-line):

公开(公告)号：US20240287347A1

公开(公告)日：2024-08-29

申请号：US18567082

申请日：2022-06-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Shunsuke KATAGIRI ,  Takuya SUZUKI

IPC: C09D151/00 ,  C08F267/10 ,  C08K5/00 ,  H05K1/03

CPC classification number: C09D151/003 ,  C08F267/10 ,  C08K5/0025 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0179

Abstract: An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention contains: a compound (A) represented by the following formula (1); and a compound (B) containing one or more carboxy groups, other than the compound (A) represented by the following formula (1):






wherein each R1 independently represents a group represented by the following formula (2) or a hydrogen atom; and each R2 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the following formula (2):










wherein -* represents a bonding hand.

公开(公告)号：US20240287219A1

公开(公告)日：2024-08-29

申请号：US18567523

申请日：2022-06-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Takuya SUZUKI ,  Shunsuke KATAGIRI

IPC: C08F22/40 ,  G03F7/029 ,  G03F7/031 ,  H05K1/03

CPC classification number: C08F22/40 ,  G03F7/029 ,  G03F7/031 ,  H05K1/0346 ,  H05K1/0373

Abstract: An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays, in particular, an active energy ray including an h-line at a wavelength of 405 nm, without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a maleimide compound (A) containing a constituent unit represented by the formula (1), and maleimide groups at both ends of the molecular chain; a photo initiator (B1) represented by the formula (2) and/or a photo initiator (B2) represented by the formula (3); and a photo initiator (C) represented by the formula (4):